Self-aligned repeatedly stackable 3D vertical RRAM
An integrated circuit structure includes a first material block comprising a first block insulator layer and a first multilayer stack on the first block insulator layer, the first multilayer stack comprising interleaved pillar electrodes and insulator layers. A second material block is stacked on the first material block and comprises a second block insulator layer, and a second multilayer stack on the second block insulator layer, the second multilayer stack comprising interleaved pillar electrodes and insulator layers. At least one pillar extends through the first material block and the second material block, wherein the at least one pillar has a top width at a top of the first and second material blocks that is greater than a bottom width at a bottom of the first and second material blocks.
1. An integrated circuit structure, comprising:
a first material block comprising:
a first block insulator layer; and
a first multilayer stack on the first block insulator layer, the first multilayer stack comprising interleaved pillar electrodes and insulator layers; and
a second material block stacked on the first material block, comprising:
a second block insulator layer; and
a second multilayer stack on the second block insulator layer, the second multilayer stack comprising interleaved pillar electrodes and insulator layers;
a plurality of conductive pillars extending through the first material block and the second material block, wherein the plurality of conductive pillars have a top width at a top of the first and second material blocks that is greater than a bottom width at a bottom of the first and second material blocks; and
a substrate on which the first and second material blocks are formed, the substrate having detectable amounts of a first polymer component and a second polymer component.
2. The integrated circuit structure of claim 1 , wherein the top width is less than approximately 100 nm.
3. The integrated circuit structure of claim 1 , wherein the plurality of conductive pillars are self-aligned from the second material block to the first material block.
4. The integrated circuit structure of claim 1 , wherein the plurality of conductive pillars exits the bottom of the first material block and is coupled to at least one of selector lines and bit lines.
5. The integrated circuit structure of claim 1 , wherein the plurality of conductive pillars comprise a switching layer and a pillar electrode, wherein the switching layer is formed along sidewalls of the plurality of conductive pillars.
6. The integrated circuit structure of claim 5 , wherein the pillar electrode comprises a conductive metal including at least one of Cu, Ru, Co, and W.
7. The integrated circuit structure of claim 5 , wherein the switching layer is selected from a group comprising TaOx, NbOx, VOx, Al 2 O 3 , HfOx, TaHfOx, TiOx, HfTiOx, HfNiOx, HfNbOx, TaNbOx, NiOx, PCMO, LSMO, In 2 O 3 , TaOx, NiOx, IGZO, ZnO, and composites thereof.
8. The integrated circuit structure of claim 5 , wherein the switching layer is approximately 5-14 nm in thickness and the pillar electrode is less than approximately 100 nm in width.
9. The integrated circuit structure of claim 1 , wherein the first polymer component and the second polymer component comprise a polystyrene (PS) component and polymethylmethacrylate (PMMA) component, respectively.