Patent Assignment
Reel/Frame 039047/0760
Assignment of Assignor's Interest
Recorded: 2016-06-29
Pages: 4
Assignor
TERAI, MASAYUKI
Executed: 2016-06-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same