IP Library › Assignment 039058/0747
Patent Assignment
Reel/Frame 039058/0747

Assignment of Assignor's Interest

Recorded: 2016-06-30 Pages: 3
Assignors
ZHAO, SAM ZIQUN
Executed: 2016-06-23
KHAN, REZAUR RAHMAN
Executed: 2016-06-24
Assignee
BROADCOM CORPORATION
5300 CALIFORNIA AVENUE, IRVINE, CALIFORNIA, 92617
Covered Property (1)
High Density Redistribution Layer (Rdl) Interconnect Bridge Using a Reconstituted Wafer
Application: 15/198,991 →
Publication: US 2017/0365565
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
Merger Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047231/0369 →
Corrective Assignment to Correct the Execution Date of the Merger and Application Nos. 13/237,550 and 16/103,107 from the Merger Previously Recorded on Reel 047231 Frame 0369. Assignor(S) Hereby Confirms the Merger. Mar 8, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048549/0113 →