Patent Assignment
Reel/Frame 039066/0985
Assignment of Assignor's Interest
Recorded: 2016-07-01
Pages: 2
Assignors
HONG, WILLIAM WEILUN
Executed: 2016-06-24
NIEN, PO-CHIN
Executed: 2016-06-24
CHEN, YING-TSUNG
Executed: 2016-06-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Doped Poly-Silicon for PolyCMP Planarity Improvement