Patent Assignment
Reel/Frame 039088/0098
Assignment of Assignor's Interest
Recorded: 2016-07-06
Pages: 3
Assignee
BROADCOM CORPORATION
5300 CALIFORNIA AVENUE, IRVINE, CALIFORNIA, 92617
Covered Property
(1)
High Density Redistribution Layer (Rdl) Interconnect Bridge Using a Reconstituted Wafer
Application:
62/350,463 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.