IP Library › Patent Application 62350463
Patent Application Provisional
App. No. 62/350,463 · Confirmation No. 3740

HIGH DENSITY REDISTRIBUTION LAYER (RDL) INTERCONNECT BRIDGE USING A RECONSTITUTED WAFER

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2016-06-29 APP.FILE.REC Filing Receipt 3 View
2016-06-15 TRAN.LET Transmittal Letter 2 View
2016-06-15 TR.PROV Provisional Cover Sheet (SB16) 2 View
2016-06-15 136A Authorization for Extension of Time all replies 1 View
2016-06-15 ADS Application Data Sheet 7 View
2016-06-15 SPEC Specification 14 View
2016-06-15 CLM Claims 5 View
2016-06-15 ABST Abstract 1 View
2016-06-15 DRW Drawings-only black and white line drawings 14 View
2016-06-15 WFEE Fee Worksheet (SB06) 2 View
2016-06-15 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
62/350,463
Filed
2016-06-15