IP Library › Assignment 039088/0414
Patent Assignment
Reel/Frame 039088/0414

Assignment of Assignor's Interest

Recorded: 2016-07-06 Pages: 3
Assignors
CHOI, DEOG-SOON
Executed: 2016-07-04
LEE, AH RON
Executed: 2016-07-04
KU, HYUN-MO
Executed: 2016-07-04
Assignee
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
NO. 1 YISHUN AVENUE 7, SINGAPORE, 768923, SINGAPORE
Covered Property (1)
Semiconductor Package Having a Solder-on-Pad Structure
Patent: 9,972,590 →
Application: 15/202,195 →
Publication: US 2018/0012856
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Oct 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047422/0464 →
Corrective Assignment to Correct the Execution Date Previously Recorded at Reel: 047422 Frame: 0464. Assignor(S) Hereby Confirms the Merger. Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0702 →