Patent Assignment
Reel/Frame 039088/0676
Assignment of Assignor's Interest
Recorded: 2016-07-06
Pages: 6
Assignors
LIN, TZU-HUNG
Executed: 2016-06-03
LIEN, CHI-CHIN
Executed: 2016-06-28
LIU, NAI-WEI
Executed: 2016-06-06
PENG, I-HSUAN
Executed: 2016-06-03
HSIAO, CHING-WEN
Executed: 2016-06-15
HUANG, WEI-CHE
Executed: 2016-06-03
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Fan-Out Package Structure Having Embedded Package Substrate