Patent Assignment
Reel/Frame 039088/0857
Assignment of Assignor's Interest
Recorded: 2016-07-06
Pages: 3
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method for Forming the Same