IP Library › Assignment 039090/0307
Patent Assignment
Reel/Frame 039090/0307

Assignment of Assignor's Interest

Recorded: 2016-07-06 Pages: 16
Assignors
ADAMS, TRACY
Executed: 2015-04-14
CHLEBOSKI, RICHARD
Executed: 2015-04-16
DANE SHULMAN ASSOCIATES, LLC
Executed: 2015-04-20
NEW ENTERPRISE ASSOCIATES 12, LP
Executed: 2015-04-16
SHAW, ROBERT W., JR.
Executed: 2015-04-16
BLACK, MARCIE R.
Executed: 2015-05-14
Assignee
ADVANCED SILICON GROUP, INC.
173 BEDFORD ROAD, LINCOLN, MASSACHUSETTS, 01773
Covered Property (1)
Double-etch nanowire process
Patent: 9,449,855 →
Application: 14/329,975 →
Publication: US 2015/0017802
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 6, 2016
From: YIM, JOANNE; MILLER, JEFFREY B.; JURA, MICHAEL; BLACK, MARCIE R.
To: BANDGAP ENGINEERING, INC.
Reel/Frame 039090/0335 →
Assignment of Assignor's Interest Jul 6, 2016
From: BANDGAP ENGINEERING, INC.
To: ADAMS, TRACY; BUCHINE, BRENT A.; CHLEBOSKI, RICHARD; DANE SHULMAN ASSOCIATES, LLC
Reel/Frame 039276/0006 →
Assignment of Assignor's Interest Oct 22, 2020
From: ADVANCED SILICON GROUP, INC.
To: ADVANCED SILICON GROUP TECHNOLOGIES, LLC
Reel/Frame 054143/0197 →