Patent Assignment
Reel/Frame 039147/0570
Assignment of Assignor's Interest
Recorded: 2016-07-13
Pages: 7
Assignors
LIM, HA-JIN
Executed: 2016-04-09
PARK, GI-GWAN
Executed: 2016-04-15
IE, SANG-YUB
Executed: 2016-04-11
LEE, JONG-HAN
Executed: 2016-04-11
YIM, JEONG-HYUK
Executed: 2016-04-11
HONG, HYE-RI
Executed: 2016-04-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Manufacturing Semiconductor Devices