Patent Assignment
Reel/Frame 039149/0113
Assignment of Assignor's Interest
Recorded: 2016-07-13
Pages: 5
Assignors
HIRATA, KAZUYA
Executed: 2016-06-28
NISHINO, YOKO
Executed: 2016-06-28
MORIKAZU, HIROSHI
Executed: 2016-06-28
PRIEWASSER, KARL
Executed: 2016-06-23
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 1438580, JAPAN
Covered Property
(1)
Wafer Thinning Method