Patent Assignment
Reel/Frame 039166/0765
Assignment of Assignor's Interest
Recorded: 2016-07-15
Pages: 3
Assignee
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property
(1)
Method for Forming an Air Gap Around a Through-Silicon Via
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.