Patent Assignment
Reel/Frame 039181/0414
Assignment of Assignor's Interest
Recorded: 2016-07-18
Pages: 8
Assignors
RAKSHIT, TITASH
Executed: 2016-07-12
OBRADOVIC, BORNA J.
Executed: 2016-07-12
SENGUPTA, RWIK
Executed: 2016-07-13
WANG, WEI-E
Executed: 2016-07-12
HATCHER, RYAN
Executed: 2013-07-12
RODDER, MARK S.
Executed: 2016-07-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including a Repeater/Buffer at Higher Metal Routing Layers and Methods of Manufacturing the Same