Patent Assignment
Reel/Frame 039182/0635
Assignment of Assignor's Interest
Recorded: 2016-07-18
Pages: 2
Assignor
YAMASHITA, TOMOHIRO
Executed: 2016-06-07
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Substrate with a Single Protruding Portion with Multiple Different Widths and Insulation Thickness