Patent Assignment
Reel/Frame 039185/0408
Assignment of Assignor's Interest
Recorded: 2016-07-19
Pages: 5
Assignors
HO, SHU CHUEN
Executed: 2016-07-04
CHEONG, CHOON HONG
Executed: 2016-07-04
ONG, CHIN GUAN
Executed: 2016-07-04
WU, KAI
Executed: 2016-07-04
KUAH, TENG HOCK
Executed: 2016-07-04
HAO, JI YUAN
Executed: 2016-07-04
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property
(1)
Molding System for Applying a Uniform Clamping Pressure Onto a Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.