Patent Assignment
Reel/Frame 039189/0787
Assignment of Assignor's Interest
Recorded: 2016-07-19
Pages: 3
Assignors
CHEN, MING-FA
Executed: 2016-07-07
YEH, SUNG-FENG
Executed: 2016-06-29
YU, CHEN-HUA
Executed: 2016-07-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method of the Same