Patent Assignment
Reel/Frame 039222/0643
Assignment of Assignor's Interest
Recorded: 2016-07-22
Pages: 6
Assignors
CO, REYNALDO
Executed: 2015-05-27
ZOHNI, WAEL
Executed: 2015-05-27
CIZEK, RIZZA LEE SAGA
Executed: 2015-04-19
KATKAR, RAJESH
Executed: 2015-05-26
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Wire Bond Support Structure and Microelectronic Package Including Wire Bonds Therefrom
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0668 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0751 →