IP Library Assignment 039236/0986
Patent Assignment
Reel/Frame 039236/0986

Assignment of Assignor's Interest

Recorded: 2016-07-01 Pages: 3
Assignors
TAKANO, SHOJI
Executed: 2016-05-27
MATSUDA, FUMIHIKO
Executed: 2016-05-27
Assignee
NIPPON MEKTRON, LTD.
12-15, SHIBA-DAIMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Manufacturing Method of Multilayer Printed Wiring Board
Patent: 9,788,439 →
Application: 15/022,292 →
Publication: US 2016/0295707
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Sep 26, 2025
From: NIPPON MEKTRON, LTD.
To: MEKTEC CORPORATION
Reel/Frame 072961/0045 →