IP Library Assignment 039272/0552
Patent Assignment
Reel/Frame 039272/0552

Assignment of Assignor's Interest

Recorded: 2016-07-27 Pages: 4
Assignor
KAMAKURA, TSUKASA
Executed: 2016-07-04
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-8980, JAPAN
Covered Property (1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium
Application: 15/220,979 →
Publication: US 2017/0029945
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0462 →