Patent Assignment
Reel/Frame 039273/0423
Assignment of Assignor's Interest
Recorded: 2016-07-27
Pages: 6
Assignors
BAIK, SEUNG-HYUN
Executed: 2016-06-13
LEE, CHEOL-WOO
Executed: 2016-06-13
PARK, WAN-HO
Executed: 2016-06-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Boards and Semiconductor Packages Including the Same