Patent Assignment
Reel/Frame 039274/0632
Assignment of Assignor's Interest
Recorded: 2016-07-27
Pages: 4
Assignors
CURIEL, MITCHELL
Executed: 2016-07-25
CHAN, HUAN GIM
Executed: 2016-07-25
KHO, WAN FOONG
Executed: 2016-07-21
Assignee
FREESCALE SEMICONDUCTOR INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735
Covered Property
(1)
Methods for Repackaging Copper Wire-Bonded Microelectronic Die
Patent:
9,799,617 →
Application:
15/221,372 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040626 Frame: 0683. Assignor(S) Hereby Confirms the Merger and Change of Name Effective November 7, 2016.
Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →