Patent Assignment
Reel/Frame 039276/0042
Assignment of Assignor's Interest
Recorded: 2016-07-28
Pages: 5
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Bonded Semiconductor Structure and Method for Forming the Same
Patent:
9,691,733 →
Application:
15/221,609 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.