Patent Assignment
Reel/Frame 039277/0889
Assignment of Assignor's Interest
Recorded: 2016-07-28
Pages: 5
Assignors
FUKUDA, MASANAO
Executed: 2016-07-22
SASAKI, TAKAFUMI
Executed: 2016-07-22
YUASA, KAZUHIRO
Executed: 2016-07-20
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device and Method of Processing Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.