IP Library › Assignment 047353/0513
Patent Assignment
Reel/Frame 047353/0513

Change of Name

Recorded: 2018-10-30 Pages: 32
Assignor
HITACHI KOKUSAI ELECTRIC INC.
Executed: 2018-06-01
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4 KANDA-KAJICHO, CHIYODA-KU, TOKYO, JAPAN
Covered Properties (4)
Substrate Processing Apparatus
Application: 13/965,242 →
Publication: US 2013/0327273
Substrate Processing Apparatus
Application: 14/592,090 →
Publication: US 2015/0140839
Method of Manufacturing Semiconductor Device and Method of Processing Substrate
Application: 15/208,708 →
Publication: US 2016/0322217
Method of Manufacturing Semiconductor Device and Substrate Processing Apparatus for Forming Film Including at Least Two Different Elements
Application: 15/468,627 →
Publication: US 2017/0200599
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 28, 2016
From: FUKUDA, MASANAO; SASAKI, TAKAFUMI; YUASA, KAZUHIRO
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 039277/0889 →
Change of Name Nov 26, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047620/0001 →