Patent Assignment
Reel/Frame 039306/0588
Assignment of Assignor's Interest
Recorded: 2016-08-01
Pages: 4
Assignor
HARADA, SEIJI
Executed: 2016-07-15
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Wafer Processing Method and Electronic Device