Patent Assignment
Reel/Frame 039309/0179
Assignment of Assignor's Interest
Recorded: 2016-08-02
Pages: 4
Assignors
WANG, CHIN-HUA
Executed: 2016-07-19
LIN, PO-YAO
Executed: 2016-07-19
YEH, SHU-SHEN
Executed: 2016-07-19
LEE, KUANG-CHUN
Executed: 2016-07-19
JENG, SHIN-PUU
Executed: 2016-07-19
LEU, SHYUE-TER
Executed: 2016-07-21
HUANG, CHENG-LIN
Executed: 2016-07-19
YU, HSIU-MEI
Executed: 2016-07-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package with Thermal Dissipation Structure and Method for Forming the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.