Patent Assignment
Reel/Frame 039323/0755
Assignment of Assignor's Interest
Recorded: 2016-08-03
Pages: 4
Assignor
KIM, YEONGSEOK
Executed: 2016-07-13
Assignee
SAMSUNG ELECTRONICS CO.,LTD.
129, SAMSUNG-RO,YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same