Patent Assignment
Reel/Frame 039327/0886
Assignment of Assignor's Interest
Recorded: 2016-08-03
Pages: 11
Assignors
TAKAYA, HIDEFUMI
Executed: 2016-06-24
SAITO, JUN
Executed: 2016-06-24
SOENO, AKITAKA
Executed: 2016-06-24
HAMADA, KIMIMORI
Executed: 2016-06-27
MIZUNO, SHOJI
Executed: 2016-07-11
AOI, SACHIKO
Executed: 2016-07-08
WATANABE, YUKIHIKO
Executed: 2016-07-08
Assignees
TOYOTA JIDOSHA KABUSHIKI KAISHA
1, TOYOTA-CHO, TOYOTA-SHI, AICHI-KEN, 4718571, JAPAN
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-SHI, AICHI-KEN, 448-8661, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing Semiconductor Device