IP Library Assignment 039330/0069
Patent Assignment
Reel/Frame 039330/0069

Assignment of Assignor's Interest

Recorded: 2016-08-03 Pages: 14
Assignors
PADMANABHAN, BALAJI
Executed: 2016-06-03
VENKATRAMAN, PRASAD
Executed: 2016-06-03
MOENS, PETER
Executed: 2016-06-03
MUDHOLKAR, MIHIR
Executed: 2016-06-03
FULTON, JOE
Executed: 2016-06-03
CELAYA, PHILLIP
Executed: 2016-06-24
ST. GERMAIN, STEPHEN
Executed: 2016-06-02
MCDONALD, JASON
Executed: 2016-07-29
YOUNG, ALEXANDER
Executed: 2016-06-13
SALIH, ALI
Executed: 2016-06-14
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Half-Bridge Hemt Circuit and an Electronic Package Including the Circuit
Patent: 9,773,895 →
Application: 15/133,644 →
Publication: US 2016/0322969
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Dec 23, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 041187/0295 →
Assignment of Assignor's Interest Feb 27, 2017
From: LIU, CHUN-LI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 041384/0166 →
Release of Security Interest in Patents Recorded at Reel 041187, Frame 0295 Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064151/0203 →