Patent Assignment
Reel/Frame 039337/0306
Assignment of Assignor's Interest
Recorded: 2016-07-14
Pages: 4
Assignors
SAKAI, KENJI
Executed: 2016-06-22
IKEDA, TOMOYUKI
Executed: 2016-06-24
FURUTANI, TOSHIKI
Executed: 2016-04-26
Assignee
IBIDEN CO., LTD.
2-1 KANDA-CHO, OGAKI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Wiring Board with Built-in Electronic Component and Method for Manufacturing the Same