Patent Assignment
Reel/Frame 039339/0502
Assignment of Assignor's Interest
Recorded: 2016-08-04
Pages: 6
Assignors
KIM, SUN-HYUN
Executed: 2016-03-28
JUNG, SANG-IL
Executed: 2016-03-28
PARK, BYUNG-JUN
Executed: 2016-03-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Having Through-Silicon via Structures