IP Library › Assignment 039343/0221
Patent Assignment
Reel/Frame 039343/0221

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2016-08-04 Received: 2016-08-04 Pages: 6
Assignors
SMITH, DANIEL
Executed: 2016-07-26
KAMINENI, HIMANI SUHAG
Executed: 2016-07-27
KAMINENI, VIMAL KUMAR
Executed: 2016-07-27
LIPPITT, MAXWELL
Executed: 2016-07-28
Assignee
GLOBALFOUNDRIES INC.
PO BOX 309, UGLAND HOUSE, GRAND CAYMAN, KYX, KY1-1104, CAYMAN ISLANDS
Covered Application (1)
METHODS OF FORMING A THROUGH-SUBSTRATE-VIA (TSV) AND A METALLIZATION LAYER AFTER FORMATION OF A SEMICONDUCTOR DEVICE
App. No. 15/228,317
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