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App. No. 15/228,317 · Confirmation No. 2607

METHODS OF FORMING A THROUGH-SUBSTRATE-VIA (TSV) AND A METALLIZATION LAYER AFTER FORMATION OF A SEMICONDUCTOR DEVICE

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Quick Facts
App. No.
15/228,317
Filed
2016-08-04
Granted
2018-03-13
Pub. No.
US20180040511A1
Art Unit
2898
PTA
0 days