Patent Assignment
Reel/Frame 039348/0908
Assignment of Assignor's Interest
Recorded: 2016-08-05
Pages: 4
Assignors
HWANG, CHIEN-LING
Executed: 2016-07-22
HSIEH, CHING-HUA
Executed: 2016-07-22
LIAO, HSIN-HUNG
Executed: 2016-07-22
HUANG, YING-JUI
Executed: 2016-07-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Fan-Out Package and Method of Fabricating the Same