IP Library Assignment 039358/0171
Patent Assignment
Reel/Frame 039358/0171

Assignment of Assignor's Interest

Recorded: 2016-08-05 Pages: 6
Assignors
LIN, YUSHENG
Executed: 2015-02-11
CHEW, CHEE HIONG
Executed: 2015-02-16
CARNEY, FRANCIS J.
Executed: 2015-02-17
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL RD., MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Semiconductor Package with Elastic Coupler and Related Methods
Patent: 9,691,732 →
Application: 15/230,076 →
Publication: US 2016/0343683
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Dec 23, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 041187/0295 →
Release of Security Interest in Patents Recorded at Reel 041187, Frame 0295 Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064151/0203 →