Patent Assignment
Reel/Frame 039368/0656
Assignment of Assignor's Interest
Recorded: 2016-08-08
Pages: 5
Assignors
WANG, SOON WEI
Executed: 2016-07-28
LIEW, HOW KIAT
Executed: 2016-07-28
CHEW, CHEE HIONG
Executed: 2016-07-28
CARNEY, FRANCIS J.
Executed: 2016-07-29
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Die Support for Enlarging Die Size
Patent:
9,748,163 →
Application:
15/230,749 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 23, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 041187/0295 →
Release of Security Interest in Patents Recorded at Reel 041187, Frame 0295
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064151/0203 →