Patent Assignment
Reel/Frame 039373/0294
Assignment of Assignor's Interest
Recorded: 2016-08-08
Pages: 6
Assignors
CHANG, CHIA-MING
Executed: 2016-07-15
LIU, CHI-WEN
Executed: 2016-05-20
LI, CHENG-CHIEN
Executed: 2016-07-15
HUANG, HSIN-CHIEH
Executed: 2016-07-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming the Same