Patent Assignment
Reel/Frame 039377/0263
Assignment of Assignor's Interest
Recorded: 2016-08-09
Pages: 10
Assignors
GOEL, SANDEEP KUMAR
Executed: 2016-08-04
LEE, YUN-HAN
Executed: 2016-08-04
ADHAM, SAMAN M.I.
Executed: 2016-08-03
GERSHOIG, MARAT
Executed: 2016-08-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Scan Architecture for Interconnect Testing in 3D Integrated Circuits