Patent Assignment
Reel/Frame 039398/0427
Assignment of Assignor's Interest
Recorded: 2016-08-10
Pages: 4
Assignors
SI, HONGBO
Executed: 2016-05-17
HILL, BRIDGET
Executed: 2016-05-17
BERNEY, BUTCH
Executed: 2016-05-17
BRIEN, DANIEL
Executed: 2016-05-18
Assignee
LAM RESEARCH AG
SEZ STRASSE 1, VILLACH, A-9500, AUSTRIA
Covered Property
(1)
Apparatus and Radiant Heating Plate for Processing Wafer-Shaped Articles