Patent Assignment
Reel/Frame 039412/0706
Assignment of Assignor's Interest
Recorded: 2016-08-12
Pages: 5
Assignors
CHIANG, YUNG-PING
Executed: 2016-08-10
SHIH, CHAO-WEN
Executed: 2016-08-10
CHANG, SHOU-ZEN
Executed: 2016-08-10
WAN, ALBERT
Executed: 2016-08-10
HSIEH, YU-SHENG
Executed: 2016-08-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Sensor Packages and Manufacturing Mehtods Thereof