Patent Assignment
Reel/Frame 039415/0408
Assignment of Assignor's Interest
Recorded: 2016-08-12
Pages: 6
Assignors
HATTORI, TAKAHIRO
Executed: 2016-06-21
SOMA, DAISUKE
Executed: 2016-06-21
ROPPONGI, TAKAHIRO
Executed: 2016-06-21
SATO, ISAMU
Executed: 2016-06-21
Assignee
SENJU METAL INDUSTRY CO., LTD.
23, SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO, 120-8555, JAPAN
Covered Property
(1)
Cu Core Ball, Solder Paste, Formed Solder, Cu Core Column, and Solder Joint