Patent Assignment
Reel/Frame 039418/0540
Assignment of Assignor's Interest
Recorded: 2016-08-12
Pages: 6
Assignors
LEE, HO-JIN
Executed: 2016-06-24
PARK, BYUNG-LYUL
Executed: 2016-06-27
AN, JIN-HO
Executed: 2016-06-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Having Through-Silicon Via Structures and Methods of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.