IP Library Assignment 039428/0845
Patent Assignment
Reel/Frame 039428/0845

PATENT RELEASE

Recorded: 2016-07-22 Received: 2016-07-22 Pages: 7
Assignors
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN 5656 AG, NLX, NETHERLANDS
Covered Applications (22)
PAINTING SYSTEM HAVING A VEHICLE WITH LIFT STRUCTURE, TABLE ACTUATOR, AND SPRAY HEAD
App. No. 13/414,199
POWER CONTROL DEVICE AND METHOD THEREFOR
App. No. 13/187,302
Multi-Core System on Chip
App. No. 12/618,311
MEMORY WITH LEVEL SHIFTING WORD LINE DRIVER AND METHOD THEREOF
App. No. 12/209,477
METHOD FOR POWER REDUCTION AND A DEVICE HAVING POWER REDUCTION CAPABILITIES
App. No. 11/914,079
METHOD FOR NOISE REDUCTION IN A PHASE LOCKED LOOP AND A DEVICE HAVING NOISE REDUCTION CAPABILITIES
App. No. 11/910,062
BYTE WRITEABLE MEMORY WITH BIT-COLUMN VOLTAGE SELECTION AND COLUMN REDUNDANCY
App. No. 11/612,626
MEMORY WITH LEVEL SHIFTING WORD LINE DRIVER AND METHOD THEREOF
App. No. 11/433,998
POWER SAVING OPERATION OF AN APPARATUS WITH A CACHE MEMORY
App. No. 10/571,636
BIT LINE PRECHARGE IN EMBEDDED MEMORY
App. No. 11/362,694
PROCESS FOR FORMING AN ELECTRONIC DEVICE INCLUDING A FIN-TYPE STRUCTURE
App. No. 11/328,668
CASCADABLE LEVEL SHIFTER CELL
App. No. 11/170,398
VERIFYING AVAILABILITY OF IDLE-MODE MOBILE SUBSCRIBER STATION IN WIRELESS ACCESS SYSTEM
App. No. 11/165,744
POWER OPTIMIZATION OF A MIXED-SIGNAL SYSTEM ON AN INTEGRATED CIRCUIT
App. No. 11/078,150
INTEGRATED CIRCUIT HAVING STRUCTURAL SUPPORT FOR A FLIP-CHIP INTERCONNECT PAD AND METHOD THEREFOR
App. No. 11/033,009
SIMPLE SELF-BIASED CASCODE AMPLIFIER CIRCUIT
App. No. 10/287,199
ESD PROTECTION FOR A CMOS OUTPUT STAGE
App. No. 10/222,235
METHOD FOR FORMING A COPPER INTERCONNECT USING A MULTI-PLATEN CHEMICAL MECHANICAL POLISHING (CMP) PROCESS
App. No. 10/175,637
INTEGRATED CIRCUIT
App. No. 10/139,197
MULTIPHASE VOLTAGE CONTROLLED OSCILLATOR
App. No. 09/968,171
LUMINAIRE BASED ON THE LIGHT EMISSION OF LIGHT-EMITTING DIODES
App. No. 09/933,557
METHOD FOR FORMING A COPPER INTERCONNECT USING A MULTI-PLATEN CHEMICAL MECHANICAL POLISHING (CMP) PROCESS
App. No. 09/835,276