Patent Assignment
Reel/Frame 039474/0904
Assignment of Assignor's Interest
Recorded: 2016-08-18
Pages: 4
Assignors
HUNG, MIN-HSIU
Executed: 2016-07-28
WANG, SUNG-LI
Executed: 2016-07-29
WU, PEI-WEN
Executed: 2016-07-28
LI, YIDA
Executed: 2016-07-28
CHANG, CHIH-WEI
Executed: 2016-07-28
HUANG, HUANG-YI
Executed: 2016-08-01
LIN, CHENG-TUNG
Executed: 2016-07-28
SHEU, JYH-CHERNG
Executed: 2016-07-29
YEO, YEE-CHIA
Executed: 2016-08-01
CHUI, CHI-ON
Executed: 2016-08-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Formation Method of Interconnection Structure of Semiconductor Device