IP Library Assignment 039476/0517
Patent Assignment
Reel/Frame 039476/0517

Assignment of Assignor's Interest

Recorded: 2016-08-18 Pages: 6
Assignors
ST. GERMAIN, STEPHEN
Executed: 2016-08-17
CONNER, DENNIS LEE
Executed: 2016-08-18
YODER, JAY A.
Executed: 2016-08-18
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Holes and Dimples to Control Solder Flow
Patent: 9,911,684 →
Application: 15/240,423 →
Publication: US 2018/0053712
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Dec 23, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 041187/0295 →
Release of Security Interest in Patents Recorded at Reel 041187, Frame 0295 Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064151/0203 →