Patent Assignment
Reel/Frame 039482/0487
Assignment of Assignor's Interest
Recorded: 2016-08-19
Pages: 8
Assignors
LEE, KEON-HUN
Executed: 2016-07-19
SIM, EUN-DEOK
Executed: 2016-07-18
YOON, SUK-HO
Executed: 2016-04-28
LEE, JEONG-WOOK
Executed: 2016-04-28
RHEE, DO-YOUNG
Executed: 2016-04-28
LEE, KEE-WON
Executed: 2016-04-28
KIM, CHUL-MIN
Executed: 2016-04-28
NAM, TAE-BANG
Executed: 2016-04-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Material Layer Stack, Light Emitting Element, Light Emitting Package, and Method of Fabricating Light Emitting Element