Patent Assignment
Reel/Frame 039490/0146
Assignment of Assignor's Interest
Recorded: 2016-08-19
Pages: 5
Assignors
WANG, SHENG-CHEN
Executed: 2015-12-21
LEE, KAI-HSUAN
Executed: 2015-12-21
YEONG, SAI-HOOI
Executed: 2015-12-21
YU, CHIA-TA
Executed: 2015-12-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device Having a Stacked Fin Structure and Manufacturing Method Thereof