Patent Assignment
Reel/Frame 039495/0388
Assignment of Assignor's Interest
Recorded: 2016-08-22
Pages: 4
Assignors
CHENG, YU-JEN
Executed: 2016-07-29
HUANG, YU-CHIH
Executed: 2016-07-29
CHEN, CHIH-HUA
Executed: 2016-08-02
CHEN, YU-FENG
Executed: 2016-08-02
TSAI, HAO-YI
Executed: 2016-08-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming a Package Structure Including a Package Layer Surrounding First Connectors Beside an Integrated Circuit Die and Second Connectors Below the Integrated Circuit Die