Patent Assignment
Reel/Frame 039498/0043
Assignment of Assignor's Interest
Recorded: 2016-08-22
Pages: 4
Assignor
KWON, HEUNG KYU
Executed: 2016-06-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
System on Package (Sop) Having Through Silicon via (Tsv) Interposer with Memory Controller Connected to Multiple Printed Circuit Boards (Pcb)